A high-order shape-morphing and high-frequency actuated 3D mesostructure with applications in multifunctional devices
Three-dimensional (3D) mesostructures, assembled from 2D patterned precursors through compressive force, are compatible with most advanced planar semiconductor technologies (e.g., photolithography), functional materials (e.g., monocrystalline silicon, plastic and metal) and length scales from macro to micro.
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